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External Visual Inspection
External Visual Inspection


 

External visual inspection is a process of verifying the attributes of parts such as components condition, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality.  Visual inspection is performed per SAE AS5553 and MIL-STD-883 Method 2009.9 and on a sample of parts from a given lot base on the sample according to the ANSI ASQE Z1.4 Table II−A.

 

Visual Inspection is a term used for inspecting electronic components under a microscope to determine if a device has been altered from its original state. During this process a device may show signs of non conformance or inconsistencies that help determine if a device has been used or if a device is new and original. This process is normally performed by a Components Test Lab or Test House for short. This process is a non-destructive and devices can be used afterwards. There are so many things to look for during a visual inspection. Here are some things generally looked for during a visual inspection of IC Devices:

Substrate Condition

BGA Condition

Package Condition

• Damaged Substrate
• Scratched Substrate Through BGA
• Left-Over Residue
• Foreign or Displaced Material

• Ball Formation
• Scratches
• Residue
• Smashed BGA
• Missing BGA
• Excess Solder Material
• Foreign or Displaced Material
• Scratched Substrate Through BGA

• Physical Dimensions
• Package Construction
• Construction Defects

     

Device Markings

Pin Indicator

Body Inspection

• Consistently Printed Device Markings
• Double Printed Markings
• Marking Placement
• Ghost Markings
• Faded Device Markings
• Marking Alignment
• Font Consistently Printed
• Illegible Markings
• Marking Orientation
• No Markings
• Laser Burns

• Texture of Pin Indicator
• Consistent Orientation
• Foreign or Displaced Material Inside Pin
• Coating Inside Pin
• Overspray Inside Pin
• Fibers from Cleaning Inside Pin
• Country of Origin
• Pin Size
• Pin Depth

• Sanding Marks
• Secondary Coating
• Pull Marks
• Tool Marks
• Flaking
• Scratches
• Molding Texture
• Foreign or Displaced Material
• Contamination
• Mold Mark
• Mold Flash
• Corrosion
• Cracks
• Chips
• Overspray
• Inconsistent Textures
• Voids

 

Lead Condition

 

• Oxidation
• Re-Tinned
• Straightened
• Refurbished
• Bent Leads
• Tool Marks
• Lead Plating Quality
• Lead Alignment
• Lead Formation
• Lead Coplanarity
• Exposed Copper

 • Scratches on Leads
• Scoring
• Voids
• Plating Composition
• Physical Dimensions
• Residue
• Distorted
• Corrosion
• Chips in Leads
• Excess Solder Materia